Tangible and Embedded Interaction 2007

15-17 February 2007: 2nd Call for Papers for Tangible and Embedded Interaction 2007, Baton Rouge, Louisiana in conjunction with 14th Annual Mardi Gras Conference, and in cooperation with ACM SigCHI.

  • Full submissions will be due October 20, 2006.
  • Submission is open from now.
  • Notification of Acceptance on December 1st.
  • The conference will take place 15-17 February 2007 in Baton Rouge, Louisiana, followed with a half-day trip to Mardi Gras in New Orleans.

Accepted papers will be published in the printed conference proceedings, and will also through cooperation with ACM be available electronically in full-text in ACM’s Digital Library.

TEI’07 is the first international conference dedicated to research in tangible and embedded interaction, and held in cooperation with ACM SigCHI. Work addressing HCI issues, design, use context, tools and technologies, as well as interactive art works are all welcome, including especially interdisciplinary submissions across these themes.

The proceedings will be available in printed form at the conference and be published electronically through the ACM Digital Library.

The conference will be held this year as the 14th Annual Mardi Gras conference at Louisiana State University, to be followed with an optional day trip to Mardi Gras in New Orleans.

The conference attempts to bring together the new field of tangible and embedded interaction, providing a meeting ground for the diverse communities of research and practice involved with tangibles — from computing, hardware, and sensor technology, to HCI, interaction design, and CSCW, to product and industrial design and interactive arts. We invite submissions from all of these perspectives, be they theoretical, conceptual, technical, applied, or artistic. The conference is designed to provide appropriate presentation forms for different types of contributions including talks, interactive exhibits, demos or performances, and posters. We invite submissions in these different areas integrated within a single-track conference. Interdisciplinary submissions are particularly welcome.

http://www.tei-conf.org

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